Contact a Sales Rep
Our apologies...
An error has occurred while submitting. Please try again later...
Thank you!
Your form was submitted successfully
3M™ Trizact™ Diamond Tile 677XAEL, available in 6-, 9-, 20- and 45-micron grades, is used in the production of silicon wafers and fabrication of metal, electronic, and optical products. The pads are specially formulated for long life. Trizact diamond pads are a structured, fixed abrasive composite pad consisting of an inorganic abrasive in an organic binder capable of lapping a multitude of substrates using industry standard equipment and processes.
The pads remove material faster than some coarse slurries, while helping limit the damage to substrates and reducing process time by up to 60%, according to 3M testing. Since they don’t require a slurry, the tiles eliminate the messy residue of slurry lapping, so your process, equipment, and manufacturing environment can be kept cleaner. This should also simplify your disposal and waste management. 3M’s proprietary Trizact structured abrasives can help make lapping less costly by starting sharp and staying sharp for longer. For use in either single or double-sided lapping, the pads mount to existing machine plates with a pressure-sensitive adhesive (PSA).
An error has occurred while submitting. Please try again later...
Your form was submitted successfully
Current product 3M™ Trizact™ Diamond Tile 677XAEL | ||
|---|---|---|
| Abrasive Material | Diamond | |
| Application | Lapping | |
| Attachment Type | PSA Back | |
| Brands | 3M | |
| Product Usage | Semiconductor Wafers, Electronic Components, Optical Prisms, Cover Glass, Optical Lenses |