- 25 mm basic system unit
- 38, 44 and 50 mm module
- 2 mm grid spacing allows for high signal density at low cost
- “Eye of the Needle” compliant pin press-fit design helps reduce manufacturing time and cost
Specifications
|
Attribute Name
|
Value
|
|---|---|
|
Brand
|
3M™
|
|
Contact Base Material
|
Copper Alloy
|
|
Flammability
|
UL 94V-0
|
|
Insulation Material
|
Glass Filled Polyester (PBT)
|
|
Insulation Resistance
|
>= 10,000 MegaOhm
|
|
Tech Sheet Number
|
TS-2267
|
|
Temperature Rating
|
-55 Degree C to +125 Degree C
|
|
Test Voltage
|
750 VAC (rms)
|
Details
- 25 mm basic system unit
- 38, 44 and 50 mm module
- 2 mm grid spacing allows for high signal density at low cost
- “Eye of the Needle” compliant pin press-fit design helps reduce manufacturing time and cost
- Three contact mating levels for Early Mate Late Break or “Hot Swap” applications help reduce manufacturing time and cost
- Feed through termination available for midplane applications
- Additional grounding rows available for improved ground bounce and EMI immunity
- Mates with 5 row 3M™ MetPak™ HSHM, UHM, and CP2 sockets
- End to end stackable with 5 row 3M™ MetPak™ HSHM, HSM, HM, and CP2 headers
- See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
- For more Information refer to Data Sheet TS2267 (TS-2267)
2 mm Type B, 95, 110 and 125 Signal Contacts
Resources
3D Models
- CP2-HB110-GA1-XXXX, 3D IGES, rev. 01 (ZIP, 4.3MB)
- CP2-HB095-GE1-XXXX, 3D Step, rev. 01 (ZIP, 475.8KB)
- CP2-HB095-GE1-XXXX, 3D Parasolid, rev. 01 (ZIP, 870.7KB)
- CP2-HB110-GA1-XXXX, 3D Parasolid, rev. 01 (ZIP, 2.7MB)
- CP2-HB125-GA1-XX, 3D IGES, rev. 01 (ZIP, 4.5MB)
- CP2-HB095-GE1-XXXX, 3D IGES, rev. 01 (ZIP, 1.2MB)
- CP2-HB110-GA1-XXXX, 3D Step, rev. 01 (ZIP, 1.5MB)
- CP2-HB125-GA1-XX, 3D Step, rev. 01 (ZIP, 1.7MB)
- CP2-HB125-GA1-XX, 3D Parasolid, rev. 01 (ZIP, 3.2MB)
Data Sheets
Discontinuation Notices
Product Change Notices
