3M™ CP2 Press-Fit Header, CP2 Series

25 mm basic system unit

38, 44 and 50 mm module

2 mm grid spacing allows for high signal density at low cost

25 mm basic system unit
38, 44 and 50 mm module
2 mm grid spacing allows for high signal density at low cost
“Eye of the Needle” compliant pin press-fit design helps reduce manufacturing time and cost
Three contact mating levels for Early Mate Late Break or “Hot Swap” applications help reduce manufacturing time and cost
Feed through termination available for midplane applications
Additional grounding rows available for improved ground bounce and EMI immunity
Mates with 5 row 3M™ MetPak™ HSHM, UHM, and CP2 sockets
End to end stackable with 5 row 3M™ MetPak™ HSHM, HSM, HM, and CP2 headers
See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
For more Information refer to Data Sheet TS2267 (TS-2267)

2 mm Type B, 95, 110 and 125 Signal Contacts

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	Current product 3M™ CP2 Press-Fit Header, CP2 Series	3M™ CP2 Press-Fit Header, CP2 Series
Connector Style	Pin Header
Contact Base Material	Copper Alloy
Contact Resistance	<= 20 MilliOhms
Current Rating	1.0 A
Electrical Load	1.0 Ampere at +70 Degree C
Factory ISO Certification	No ISO Certification information available
Flammability	UL 94V-0
Insulation Color	Beige
Insulation Material	Glass Filled Polyester (PBT)
Insulation Resistance	>= 10,000 MegaOhm
Mating Contact Finish Material	Gold
Mating Contact Finish Thickness (Imperial)	30 µin
Mating Contact Finish Thickness (Metric)	0.76 µm
Mating Force	<= 0.75N/PIN
Mating and Un-mating Operations	50
Mounting Type	Boardmount
Number of Contact Rows	5 , 7
Number of Contacts	125 , 133 , 154 , 175
PCB Mounting Style	Through Hole
PCB Thickness	2.4-5.6 mm

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