3M™ CP2 Press-Fit Header, CP2 Series

  • 3M ID B00036515
  • UPC 00051119933840

25 mm basic system unit

38, 44 and 50 mm module

2 mm grid spacing allows for high signal density at low cost

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Frequently viewed resources
Tech Data Sheet (PDF, 914KB)

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Details

Highlights
  • 25 mm basic system unit
  • 38, 44 and 50 mm module
  • 2 mm grid spacing allows for high signal density at low cost
  • “Eye of the Needle” compliant pin press-fit design reduces manufacturing time and cost
  • Three contact mating levels for Early Mate Late Break or “Hot Swap” applications reduces manufacturing time and cost
  • Feed through termination available for midplane applications
  • Additional grounding rows available for improved ground bounce and EMI immunity
  • Mates with 5-row 3M™ MetPak™ HSHM, UHM and CP2 Sockets
  • End-to-end stackable with 5-row 3M™ MetPaK™ HSHM, HM and CP2 Headers
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more Information refer to Data Sheet TS2263 (TS-2263)

2 mm Type AB, 95, 110 and 125 Signal Contacts

Typical properties

Resources

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Connector Style Pin Header
Contact Base Material Copper Alloy
Contact Resistance <= 20 MilliOhms
Current Rating 1.0 A
Electrical Load 1.0 Ampere at +70 Degree C
Factory ISO Certification No ISO Certification information available
Insulation Color Beige
Insulation Flammability Rating UL 94V-0
Insulation Material Glass Filled Polyester (PBT)
Insulation Resistance >= 10,000 MegaOhm
Mating Contact Finish Material Gold
Mating Contact Finish Thickness (Imperial) 30 µin
Mating Contact Finish Thickness (Metric) 0.76 µm
Mating Force 0.75 N/contact maximum
Mounting Type Boardmount
Number of Contact Rows 5 , 7
Number of Contacts 95 , 154
Orientation Vertical
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PCB Thickness 2.4-5.6 mm for 3.7 mm tails, 1.4-5.6 mm for 2.3 mm tails
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