- 25 mm basic system unit
- 38, 44 and 50 mm module
- 2 mm grid spacing allows for high signal density at low cost
- “Eye of the Needle” compliant pin press-fit design reduces manufacturing time and cost
Specifications
|
Attribute Name
|
Value
|
|---|---|
|
Brand
|
3M™
|
|
Connector Style
|
Pin Header
|
|
Contact Base Material
|
Copper Alloy
|
|
Flammability
|
UL 94V-0
|
|
Insulation Material
|
Glass Filled Polyester (PBT)
|
|
Insulation Resistance
|
>= 10,000 MegaOhm
|
|
Mounting Type
|
Boardmount
|
|
Orientation
|
Vertical
|
|
Tech Sheet Number
|
TS-2263
|
|
Temperature Rating
|
-40 Degree C to +85 Degree C, -55 (Deg) C to +125 (Deg) C
|
|
Test Voltage
|
750 VAC (rms)
|
|
Withstanding Voltage
|
750 Vrms
|
Details
- 25 mm basic system unit
- 38, 44 and 50 mm module
- 2 mm grid spacing allows for high signal density at low cost
- “Eye of the Needle” compliant pin press-fit design reduces manufacturing time and cost
- Three contact mating levels for Early Mate Late Break or “Hot Swap” applications reduces manufacturing time and cost
- Feed through termination available for midplane applications
- Additional grounding rows available for improved ground bounce and EMI immunity
- Mates with 5-row 3M™ MetPak™ HSHM, UHM and CP2 Sockets
- End-to-end stackable with 5-row 3M™ MetPaK™ HSHM, HM and CP2 Headers
- See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
- For more Information refer to Data Sheet TS2263 (TS-2263)
2 mm Type AB, 95, 110 and 125 Signal Contacts
Resources
3D Models
- CP2-HAB110-GA4-XXXX, 3D Step, rev. 01 (ZIP, 1.9MB)
- CP2-HAB110-GA4-XXXX, 3D IGES, rev. 01 (ZIP, 5.6MB)
- CP2-HAB110-GA1-XXXX, 3D Parasolid, rev. 01 (ZIP, 2.8MB)
- CP2-HAB110-GA1-XXXX, 3D IGES, rev. 01 (ZIP, 4.0MB)
- CP2-HAB110-GA1-XXXX, 3D Step, rev. 01 (ZIP, 1.5MB)
- CP2-HAB110-GA4-XXXX, 3D Parasolid, rev. 01 (ZIP, 3.6MB)
Data Sheets
Discontinuation Notices
Product Change Notices
Safety Data Sheets
