3M™ MetPak™ 2-FB Socket, MP2 Series

  • End-to-end stackable
  • Offset dual-beam contact minimizes insertion force
  • Molded guide fingers provide integrated alignment
  • Alignment wafer for true position
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Typical Properties
Attribute Name
Value
Brand
MetPak™
Color Family
Beige
Connector Style
Receptacle
Contact Base Material
Copper Alloy
Current Rating
1.5 A
Features
Board Guide, Board Lock, Spacer
Flammability
UL 94V-0
Insulation Material
High Temperature LCP
Insulation Resistance
10^3 MegaOhms
Mating Contact Finish Material
Gold
Mating Contact Finish Thickness (Imperial)
30 µin
Mating Contact Finish Thickness (Metric)
0.76 µm
Mounting Type
Boardmount
Number of Contact Rows
5
Number of Contacts
30, 60, 90
Packaged Form
Bulk
PCB Mounting Angle
Right Angle
PCB Mounting Style
Through Hole
Pitch (Imperial)
0.079 in
Pitch (Metric)
2 mm
Product Series
MP2
TDS Required
Yes
Tech Sheet Number
TS-1117
Temperature Rating
-55 Degree C to +125 Degree C
Wiping Area (Plating)
See Ordering Information
Withstanding Voltage
1000 VAC
Details
  • End-to-end stackable
  • Offset dual-beam contact minimizes insertion force
  • Molded guide fingers provide integrated alignment
  • Alignment wafer for true position
  • Mates with MP2-P inverse headers and elevated inverse headers, MP2-PXXXE, for extended card applications
  • Protective Push-Cap on Press-Fit Only
  • Meets IEC 61076-4-104 Futurebus+® global standard
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information, refer to Data Sheet TS1117 (TS-1117)

2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers

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