- 70 minute worklife
- Non-corrosive to copper
- Rigid potting compound
- General industrial, sporting goods, solar energy, wind energy, composites, electronics, military, transportation and aerospace
|
Attribute Name
|
Value
|
|---|---|
|
Adhesive Type
|
Epoxy
|
|
Applications
|
Encapsulating, Potting, Sealing, Potting and Encapsulating, Structural Bonding
|
|
Design Challenges
|
Noise Vibration & Harshness Control NVH
|
|
Flame Retardant
|
UL94 HB
|
|
Full Cure Time
|
48 Hours @ 72 F (22 C)
|
|
Hardness
|
83 Shore D
|
|
Indoor/Outdoor
|
Both
|
|
Industries
|
Construction, Consumer Goods, Electronics, General Industrial, Metalworking, Military and Government, Signage, Specialty Vehicle, Transportation, Woodworking
|
|
Mix Ratio Volume Base:Accelerator
|
1 : 1
|
|
Open Time
|
60 minutes @ 72 F (22 C)
|
|
Physical Form
|
Liquid
|
|
Position
|
Good
|
|
Product Form
|
Each
|
|
Product Type
|
Epoxy Adhesive
|
|
Shear Strength
|
2500 Pound_Per_Square_Inch
|
|
Shelf Life in Months (from date of manufacture)
|
15
|
|
Specific Gravity
|
1.06
|
|
Storage Temperature
|
60-80 F (16-27 C)
|
|
Substrate 1
|
Metal
|
|
Substrate 2
|
Metal
|
|
Viscosity
|
Self-Leveling
|
|
Viscosity Range (cps) at Room Temperature
|
12,000
|
|
Volume (Metric)
|
50 mL
|
- 70 minute worklife
- Non-corrosive to copper
- Rigid potting compound
- General industrial, sporting goods, solar energy, wind energy, composites, electronics, military, transportation and aerospace
- Bonding, gluing, joining, attaching, assembling, encapsulating, potting and sealing.
Especially good for electronics. For potting, protection and sealing.
3M™ Scotch-Weld™ Epoxy Potting Compound 270 is low viscosity for easy dispensing and potting. Non-corrosive to copper, non-exotherming and high flow. For potting and bonding electronic and electrical components.
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