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3M™ Polyimide Film Tape 5413, Gold, 9,5 mm x 32,9 m x 0,07 mm, 3 Rolls/Pack

  • 3M ID 70016039193

The DuPont™ Kapton(R) polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures

Is dimensionally stable at high temperatures, which prevents rework, enabling high productivity

Is flame retardant, chemical and radiation resistant which protects surfaces to help reduce replacement costs

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Frequently viewed resources
Tech Data Sheet (PDF, 116KB)

Details

Highlights
  • The DuPont™ Kapton(R) polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
  • Is dimensionally stable at high temperatures, which prevents rework, enabling high productivity
  • Is flame retardant, chemical and radiation resistant which protects surfaces to help reduce replacement costs
  • The silicone adhesive's high temperature performance reduces adhesive transfer which helps to eliminate cleaning, enabling high productivity
  • Available on cardboard or polyethyelene core

3M™ Polyimide Film Tape 5413 is made with polyimide film and a silicone adhesive. It is used for PCB solder masking and other high temperature applications.

"Use 3M™ Polyimide Film Tape 5413 for PCB solder masking and other high temperature applications within a range of 73 °C to 260 °C. This amber coloured, 2.7 mil thick tape is made with an polyimide film and a silicone adhesive. It also features a polyethylene tape core instead of cardboard. The silicone adhesive's high temperature performance reduces adhesive transfer which helps eliminate cleaning, allowing you to keep productivity high. Polyimide film provides an excellent release as it doesn’t soften and stays dimensionally stable at high temperatures – preventing rework. Surfaces are protected due to this tapes flame retardancy, chemical and radiation resistance, reducing replacement costs."

Suggested applications
  • Use for masking protection of gold fingers of printed circuit boards during wave solder or solder dip process
  • Release surface in fabrication of parts cured at elevated temperature

Specifications

Resources

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