A machine creating a semiconductor wafer, the fluoropolymer seals and gaskets are used in semiconductor manufacturing equipment/machines.
Help protect your yield with long-lasting seals.
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High performance fluoropolymers for semiconductor seals and gaskets

Making the smaller chips that power next-generation technologies, including 5G devices, requires more demanding manufacturing processes than ever before. This means harsher chemicals and hotter temperatures, which all adds greater wear and tear on equipment – especially seals and gaskets.

When used in seals and gaskets, 3M™ Dyneon™ Perfluoroelastomers and Fluoroelastomers help resist damage from harsh process conditions, extending the life of semiconductor production equipment and reducing costly and potentially dangerous seal failures.

  • Two fluoropolymer o-rings on a semiconductor wafer.

    Industry expertise built through experience

    Our materials are backed by decades of experience in fluoropolymer design and manufacturing. When you choose 3M, you not only get materials that help you build a better process – you get the benefit of expert application engineering support dedicated to helping meet the needs of the unique challenges and evolving landscape of the semiconductor market. 

    View 3M™ Dyneon ™ Perfluoroelastomers (PFE) Brochure

Semiconductor Sealing Applications

From deposition to etching, these processes pose unique challenges to manufacturing equipment, which can be addressed by using materials designed to stand up to them. 3M™ Dyneon™ High Temperature Perfluoroelastomers are engineered to deliver excellent reliability under the toughest process conditions, including wet side and plasma etching.

Dry Side: Plasma Gases
  • Proven performance with plasma gases including NF3, Oxygen, SF6, CF4 and ozone
  • Resists breakdown to reduce contamination of end products
  • Can be compounded without inorganic fillers to prevent contamination during processing

Featured Solutions:


Dry Side: Thermal Processes
  • Resists very high process temperatures – capable of excursions above 315°C (599°F)
  • Dependable performance under tough conditions

Featured Solutions:


Wet Side
  • Strong resistance to harsh chemicals including H2O2, water, sulfuric acid, and more
  • Resists breakdown to reduce contamination of end products

Featured Solutions:


  • Man in lab attire holding 3M™ Dyneon™ High Temperature Perfluoroelastomers.

    3M™ Dyneon™ High Temperature Perfluoroelastomers

    • Ideal for dry side process in semiconductor manufacturing, including plasma
    • Broad chemical and thermal stability
    • Low extractables, outgassing and particle generation
    • Excellent compression set for enhanced seal life
    • Clear and translucent grades available

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Need help with a tough materials challenge? Get in touch with us today for product, technical or application advice or if you want to collaborate with a 3M Technical Specialist.