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Maximize machine usage. Protect chip yield. Achieve and maintain production goals by utilizing 3M™ High Performance Sealing Material Solutions.
Semiconductor manufacturing is trending in very clear directions: smaller, thinner and more powerful. Technologies like 5G, IoT and others drive the need for more demanding manufacturing processes than ever before. That means hotter temps, harsher chemicals and exposure to plasma. For seals and gaskets, that’s just the start.
3M™ Dyneon™ Fluoropolymers, including 3M™ Dyneon™ Perfluoroelastomers (PFE) and 3M™ Dyneon™ FKM can give semiconductor seals the ideal characteristics to help you meet your specific needs. Seals and gaskets can be more durable and help you keep your equipment running longer. They can also help you reduce your maintenance and downtime, and maximize your overall semicon production efficiency.
Typical applications include:
Deposition, plasma ashing, etching and other processes pose unique challenges to manufacturing equipment. Our full range of fluoropolymers, seals and gaskets can be made specifically to stand up to each one.
As semiconductor equipment is subject to greater wear and tear, it’s more important than ever for semicon manufacturers to quantify their total cost and value over time. This goes well beyond the cost of the parts – especially for seals and gaskets. The right seals can last longer, and help you prevent costly failures. They can also be optimized for low stiction during replacement, so they can help you reduce your semiconductor equipment maintenance and minimize downtime.
Material costs: 3M has a breadth of solutions to help you meet your material cost needs.
Installation costs: 3M™ Dyneon™ Perfluoroelastomers (PFE) combined with our proprietary catalysts can produce a low-sticking layer that makes seal installation and replacement faster and easier.
Downtime costs: Excellent plasma resistance, compression set and chemical resistance can help extend O-ring life in some of the harshest environments – and keep machines up and running longer.
Our 3M experts can help you choose the right materials for high performance seals for your semiconductor manufacturing equipment applications. Recipes can be optimized for a range of conditions such as high temperatures, harsh chemicals, and exposure to plasma while minimizing the total cost of ownership.
Our high temperature material solutions are capable of excursions above 315⁰C with dependable performance under tough conditions. They are commonly used in etching and deposition applications.
Material solutions deliver with proven performance for exposure to plasma gases including NF₃, O₂, SF₆, CF₄ and Ozone, while resisting material breakdown to reduce contamination risks. They are commonly used in etching applications.
Material solution delivers strong resistance to harsh chemicals including H₂O₂, water, sulfuric acid and others to resist breakdown and reduce risk of contamination. It is commonly used in wet and subfab applications.
Together, we can help you optimize your end product designs to exact specifications, from initial polymer and catalyst selection through recipe optimization to simulation testing and confirmation. Get in touch with us today.