As the industry demands more complex chip design to power next-generation technologies including 5G devices, the need to maintain process purity becomes more critical than ever.
When you choose 3M™ Dyneon™ Fluorothermoplastics, you get materials with the right mix of properties to help prevent contamination to help ensure there are no defects that could affect the quality of your end products. What’s more, the dependable performance of these materials can help increase yield to get the most out of your semiconductor manufacturing equipment – helping to reduce costly downtime and waste.
3M™ Dyneon™ Fluorothermoplastics offer properties you can depend on for reliable and consistent performance across your facility, including temperature and chemical resistance. Our materials are backed by decades of experience in fluoropolymer design and manufacturing and shaped by our longstanding commitment to the semiconductor industry. At 3M, we are dedicated to this industry and we actively participate in industry committees staying up to date with ever-evolving design challenges.
Your production process comes with unique fluid handling challenges, including the presence of harsh cleaning and etching chemicals, high heat, or the need to handle ultra-pure water. Our fluorothermoplastics are engineered to withstand the toughest conditions while maintaining purity and integrity.
3M™ Dyneon™ PFA can be extruded or injection molded to manufacture parts such as:
3M™ Dyneon™ PTFE is best suited for manufacturing compression molded parts such as:
3M™ Dyneon™ Fluorothermoplastic materials are suitable for a variety of uses across your facility, from wafer carriers, etch basins, fluid handling systems and more.
Need help with a tough materials challenge? Get in touch with us today for product, technical or application advice or if you want to collaborate with a 3M Technical Specialist.