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  6. 3M™ Trizact™ CMP Pad MR860HP, 29.5 in diameter

3M™ Trizact™ CMP Pad MR860HP, 29.5 in diameter

Part Number MR860HP3M ID 7100207318
  • Precisely engineered three-dimensional microreplicated asperities and pores, helps to ensure uniform asperity diameter and height and pore depth.
  • An innovative groove design helps provide efficient and uniform slurry flow distribution.
  • The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of advanced node CMP processes.
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Specifications
Attribute Name
Value
Brand
Trizact™
Manufacturing Location
United States
Overall Diameter (Imperial)
29.5 in
Overall Diameter (Metric)
749.3 mm
Product Details
  • Precisely engineered three-dimensional microreplicated asperities and pores, helps to ensure uniform asperity diameter and height and pore depth.
  • An innovative groove design helps provide efficient and uniform slurry flow distribution.
  • The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of advanced node CMP processes.

3M™ Trizact™ CMP Pad uses microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life.

An innovative pad for Chemical Mechanical Polishing (CMP) for advanced node semiconductor manufacturing.

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Product Disclaimer
  • Use of pad conditioners in process is pad dependent. Additional processes may be supported, contact 3M lab to verify product recommendations
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