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  6. 3M™ Trizact™ CMP Pad MR860H, 29.5 in diameter

3M™ Trizact™ CMP Pad MR860H, 29.5 in diameter

  • Part Number MR860H
  • 3M ID 7100195300
Overall Diameter (Imperial) 29.5 in
Overall Diameter (Metric) 749.3 mm

Details

3M™ Trizact™ CMP Pads use microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life. This proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner, enabling you to have lower cost of ownership and less downtime.

An innovative CMP material, 3M™ Trizact™ CMP Pads are for advanced node semiconductor manufacturing. Their precisely engineered three-dimensional microreplicated asperities and pores helps to ensure uniform asperity diameter, height and pore depth. The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of semiconductor fabrication. The innovative groove design on these CMP pads help provide efficient and uniform slurry flow distribution.

Recommended Applications: Advanced Node (Memory and Logic), CMP, Semiconductor Fabrication, and Wafer Manufacturing

Typical properties

Resources

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Overall Diameter (Imperial) 29.5 in
Overall Diameter (Metric) 749.3 mm