3M™ Trizact™ CMP Pad MR860H, 30.5 in diameter

Part Number MR860H
3M ID 7100195301

Uniformity in the chemical mechanical planarization (CMP) process

Consistent texture from pad to pad

Stability through pad life

Frequently viewed resources

Overall Diameter (Imperial)	30.5 in
Overall Diameter (Metric)	774.7 mm

Typical properties

Details

Highlights

Uniformity in the chemical mechanical planarization (CMP) process
Consistent texture from pad to pad
Stability through pad life
Improved planarization efficiency to enable advanced node CMP
Reduced dishing and erosion
Less pad debris for fewer defects
Reduced metal contamination risk

3M™ Trizact™ CMP Pads use microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life. This proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner, enabling you to have lower cost of ownership and less downtime.

An innovative CMP material, 3M™ Trizact™ CMP Pads are for advanced node semiconductor manufacturing. Their precisely engineered three-dimensional microreplicated asperities and pores helps to ensure uniform asperity diameter, height and pore depth. The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of semiconductor fabrication. The innovative groove design on these CMP pads help provide efficient and uniform slurry flow distribution.

Recommended Applications: Advanced Node (Memory and Logic), CMP, and Semiconductor Fabrication

Resources

Related products

	Current product 3M™ Trizact™ CMP Pad MR860H, 30.5 in diameter	3M™ CMP Pad Conditioner Brush	3M™ Trizact™ Pad Conditioner
Overall Diameter (Imperial)	30.5 in
Overall Diameter (Metric)	774.7 mm

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Use of pad conditioners in process is pad dependent. Additional processes may be supported, contact 3M lab to verify product recommendations

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