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  6. 3M™ Trizact™ CMP Pad MR665L, 29.5 in diameter

3M™ Trizact™ CMP Pad MR665L, 29.5 in diameter

  • Part Number MR665L
  • 3M ID 7100180525
  • UPC 00638060824467

Uniformity in the chemical mechanical planarization (CMP) process

Consistent texture from pad to pad

Stability through pad life

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Overall Diameter (Imperial) 29.5 in
Overall Diameter (Metric) 749.3 mm

Details

Highlights
  • Uniformity in the chemical mechanical planarization (CMP) process
  • Consistent texture from pad to pad
  • Stability through pad life
  • Improved planarization efficiency to enable advanced node CMP
  • Reduced dishing and erosion
  • Less pad debris for fewer defects
  • Reduced metal contamination risk

3M™ Trizact™ CMP Pad MR665L, 29.5 inch diam uses microreplication technology to provide precise asperity control for low defectivity and consistent pad performance throughout pad life.

An innovative CMP material, 3M™ Trizact™ CMP Pads are for advanced node semiconductor manufacturing. Their precisely engineered three-dimensional microreplicated asperities and pores helps to ensure uniform asperity diameter, height and pore depth. The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of semiconductor fabrication. The innovative groove design on these CMP pads help provide efficient and uniform slurry flow distribution.

Recommended Applications: Advanced Node (Memory and Logic), CMP, Semiconductor Fabrication, and Wafer Manufacturing

Typical properties

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Overall Diameter (Imperial) 29.5 in
Overall Diameter (Metric) 749.3 mm