3M™ Trizact™ CMP Pad MR665L, 30.5 in diameter

Part Number MR665L
3M ID 7100180524
UPC 00638060824450

Uniformity in the chemical mechanical planarization (CMP) process

Consistent texture from pad to pad

Stability through pad life

Frequently viewed resources

Overall Diameter (Imperial)	30.5 in
Overall Diameter (Metric)	774.7 mm

Typical properties

Details

Highlights

Uniformity in the chemical mechanical planarization (CMP) process
Consistent texture from pad to pad
Stability through pad life
Improved planarization efficiency to enable advanced node CMP
Reduced dishing and erosion
Less pad debris for fewer defects
Reduced metal contamination risk

3M™ Trizact™ CMP Pad MR665L, 30.5 inch diam uses microreplication technology to provide precise asperity control for low defectivity and consistent pad performance throughout pad life.

An innovative CMP material, 3M™ Trizact™ CMP Pads are for advanced node semiconductor manufacturing. Their precisely engineered three-dimensional microreplicated asperities and pores helps to ensure uniform asperity diameter, height and pore depth. The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of semiconductor fabrication. The innovative groove design on these CMP pads help provide efficient and uniform slurry flow distribution.

Recommended Applications: Advanced Node (Memory and Logic), CMP, and Semiconductor Fabrication

Resources

3M™ Trizact™ CMP Pad MRXXX Series

Data Sheets

(PDF , 88KB)

Related products

	Current product 3M™ Trizact™ CMP Pad MR665L, 30.5 in diameter	3M™ CMP Pad Conditioner Brush	3M™ Trizact™ Pad Conditioner
Overall Diameter (Imperial)	30.5 in
Overall Diameter (Metric)	774.7 mm

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Use of pad conditioners in process is pad dependent. Additional processes may be supported, contact 3M lab to verify product recommendations

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