3M™ Diamond Pad Conditioner A63, 4.25-in dia

Part Number A633M ID 7010325614
  • Optimized for extended pad and disk life
  • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
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Specifications
Attribute Name
Value
Abrasive Material
Nickel based alloy with patterned diamond
Abrasive Working Surface
Ring Face
Aggressiveness
1-4
Application
CMP
Brand
3M™
Carrier Color
Gray
Carrier Diameter (Imperial)
4.25 in
Carrier Diameter (Metric)
107.95 mm
Carrier Form
Disc
Carrier Format
Disk - with bevel edge
Carrier Material
304 Stainless Steel
Carrier Size
4.25 inch diameter
Carrier Substrate
304 SS
Diamond Size
63 um
Diamond Type
Type 2, blocky
Manufacturing Location
United States
Product Type
Diamond Pad Conditioner
Product Details
  • Optimized for extended pad and disk life
  • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
  • Customizable for conditioning aggressiveness
  • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity

3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.

Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.

3M is redefining CMP

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Product Disclaimer
  • Use of pad conditioners in process is pad dependent. Additional processes may be supported, contact 3M lab to verify product recommendations
  • The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes
  • 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.