3M™ Diamond Pad Conditioner H80-AL, 95 mm diameter

• Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
• Optimized for extended pad and disk life
• Diamonds secured with both chemical and mechanical bonds for great retention
• Exclusive polymer substrate enhances corrosion resistance
• Customizable for conditioning aggressiveness
• Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.