3M™ High-Speed Card-Edge Connector, SPD08 Series, SPD08-050-RB-TR

  • Card-edge high-speed board-to-board connector
  • Supports flexible stacking height (16-40 mm) mezzanine applications using a riser card
  • High-density (0.8 mm pitch), two-row design conserves board space and simplifies trace routing
  • Robust contact design is tolerant of misalignment, provides a reliable connection and supports blind mate applications
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Typical Properties
Attribute Name
Value
Current Rating
1.2 A
Maximum Operating Temperature (Celsius)
125 Degree Celsius
Maximum Operating Temperature (Fahrenheit)
257 Degree Fahrenheit
Minimum Operating Temperature (Celsius)
-55 Degree Celsius
Minimum Operating Temperature (Fahrenheit)
-67 Degree Fahrenheit
Product Color
Black
Product Series
SPD08
TDS Required
Yes
Tech Sheet Number
TS-2420
Details
  • Card-edge high-speed board-to-board connector
  • Supports flexible stacking height (16-40 mm) mezzanine applications using a riser card
  • High-density (0.8 mm pitch), two-row design conserves board space and simplifies trace routing
  • Robust contact design is tolerant of misalignment, provides a reliable connection and supports blind mate applications
  • Controlled impedance, crosstalk limiting contact design supports speeds up to 15 Gbps
  • Embedded ground plane within riser card limits row to row crosstalk and enhances signal integrity
  • Supports up to 25 Gbps wire to board applications using 3M™ Twin Axial Cable terminated to the card-edge
  • Flexible design supports 20-200 contact positions
  • Available with optional latches for robust mechanical stability
  • 0.5A current rating per contact
  • Typically used in datacom, enterprise servers, telecom, industrial, test and military applications
  • Supports XAUI, PCI express (Gen 1/2/3), SATA and other application speeds
  • For more information refer to Customer Drawing 78-5100-2420-7

0.8 mm, Card-Edge, SMT

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