Attribute Name
|
Value
|
---|---|
Abrasive Material
|
Nickel-based Alloy with Patterned Diamond
|
Abrasive Working Surface
|
Segmented
|
Application
|
CMP
|
Carrier Form
|
Bar
|
Carrier Length (Imperial)
|
11.63 in
|
Carrier Length (Metric)
|
295.402 mm
|
CMP Process
|
Cu (Bulk), W (Bulk)
|
Manufacturing Location
|
United States
|
Product Series
|
R400
|
TDS Required
|
Yes
|
Highly engineered pad conditioners deliver reliable performance offering excellent diamond retention, with controlled diamond placement and protrusion for critical semiconductor CMP applications.