Bonds to dentin, cut and uncut enamel without a separate etch step
Clinically proven
Very low incidence of post-operative sensitivity
Desensitizes hypersensitive root surfaces
Simplifies sealant technique
Cures with any light source – halogen, laser, plasma or LED
Ensures hygienic delivery of the adhesive material
Extra small applicator works well with very small preperations and in hard-to-reach areas of the mouth
Offers easy activation and high performance. The unique 3M™ L-Pop™ delivery system is fast and easy to use, allowing you to etch, prime and bond in a single step.
Suggested applications
Bonding between dentin/enamel and direct, light-cured composite and compomer filling materials
Bonding light-cured pit and fissure sealants
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