- Bonds to dentin, cut and uncut enamel without a separate etch step.
- Clinically proven.
- Very low incidence of post-operative sensitivity.
- Desensitizes hypersensitive root surfaces.
- Simplifies sealant technique.
- Cures with any light source – halogen, laser, plasma or LED.
- Ensures hygienic delivery of the adhesive material.
- Extra small applicator works well with very small preperations and in hard-to-reach areas of the mouth.
Offers easy activation and high performance. The unique 3M™ L-Pop™ delivery system is fast and easy to use, allowing you to etch, prime and bond in a single step.
- Bonding between dentin/enamel and direct, light-cured composite and compomer filling materials
- Bonding light-cured pit and fissure sealants
- Root surface desensitization