3M™ Boron Nitride Cooling Filler Flakes

3M ID B5005473001

Hard agglomerates from oriented platelets increase in-plane and through-plane thermal conductivity of finished plastic parts

Used for adding thermal conductivity to thermoplastic polymers, thermosets and elastomers

High electrical insulation properties with low Dk and Df

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Tech Data Sheet (PDF, 1005KB)

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Higher thermal conductivity. Balanced filler loadings.

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Details

Highlights

Hard agglomerates from oriented platelets increase in-plane and through-plane thermal conductivity of finished plastic parts
Used for adding thermal conductivity to thermoplastic polymers, thermosets and elastomers
High electrical insulation properties with low Dk and Df
Grades available for controlled low viscosity
Excellent as secondary fillers for boosting thermal conductivity in compounds

3M™ Boron Nitride Cooling Filler flakes are oriented crystalline boron nitride platelets formed into flakes. Used as an additive, these larger particle flakes increase in-plane and through-plane thermal conductivity in compound resins. A range of 3M BN cooling filler flakes includes grades for thermoplastics, thermosets and elastomers, and many are excellent for boosting the thermal conductivity of complex compounds.

Balanced Thermally-conductive Properties
Compatible with Multiple Polymer Resin
Excellent as Boosters
Works with Other Secondary Fillers

Excellent for balanced in-plane and through-plane conductivity

3M BN cooling filler flakes orient both randomly and partially aligned within compounds, creating a balance of in-plane and through-plane thermal conductivity. Grades are available to achieve desired properties including higher thermal conductivity and maintained low compound viscosity. 3M BN cooling filler flakes are an excellent choice for boosting the thermal conductivity of finished plastic parts without compromising other properties.

A complete selection of 3M™ Boron Nitride Cooling Fillers includes platelets, flakes and agglomerates to meet a full range of performance specifications for in-plane and through-plane thermal conductivity.

Grades of 3M™ Boron Nitride Cooling Filler flakes

CFF 500-3 and 200-3

These grades deliver higher through-plane thermal conductivity to finished parts. They are recommended as secondary fillers for boosting the thermal conductivity of compounds.
CFF 500-15 and 200-15

There are preferred grades for the lowest viscosity in epoxies and silicones.

Table showing bulk density determined according to ASTM B329/ISO 3923-2 (Scott density) and according to ISO 23145-2 (DIN density).

Bulk density determined according to ASTM B329/ISO 3923-2 (Scott density) and according to ISO 23145-2 (DIN density)
Particle size distribution measured by laser light scattering (Mastersizer 2000, dispersion in ethanol)
For calculation purpose: Density of bulk hBN 2.25 g/cm³

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