3M™ Adper™ Prompt™ L-Pop™ Self-Etch Adhesive

  • Options available
  • | Select product options for IDs.

Bonds to dentin, cut and uncut enamel without a separate etch step.

Clinically proven.

Very low incidence of post-operative sensitivity.

View more details
Frequently viewed resources
Tech Data Sheet (PDF, 458KB)Safety Data Sheet (PDF, 0B)

Details

Highlights
  • Bonds to dentin, cut and uncut enamel without a separate etch step
  • Clinically proven
  • Very low incidence of post-operative sensitivity
  • Desensitizes hypersensitive root surfaces
  • Simplifies sealant technique
  • Cures with any light source – halogen, laser, plasma or LED
  • Ensures hygienic delivery of the adhesive material
  • Extra small applicator works well with very small preperations and in hard-to-reach areas of the mouth

Offers easy activation and high performance. The unique 3M™ L-Pop™ delivery system is fast and easy to use, allowing you to etch, prime and bond in a single step.

Suggested applications
  • Bonding between dentin/enamel and direct, light-cured composite and compomer filling materials
  • Bonding light-cured pit and fissure sealants
  • Root surface desensitization

Specifications

Resources

Reviews