3M™ Thermally Conductive Silicone Interface Pad 5591 is a highly conformable and ultra-soft pad with thermal conductivity of 1.0 W/m-K (ASTM D5470). This pad consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.
3M™ Thermally Conductive Silicone Interface Pad 5591 has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Heat transfer between PCB and heat sink
Integrated chip (IC) packaging heat conduction
Chip on film (COF) heat dissipation
Gap filling in electronic devices
Decrease of compression stress to electronic parts by thermal pad softness
Electric vehicle (EV) batteries
Wireless charging units
Process control equipment
Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.
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