3M™ Textool™ Test & Burn-In Ball Grid Array Sockets 90XX Series

  • Double-beam normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress
  • Contact tips touch ball above its center plane moving ball deformation away from seating plane
  • Designed to allow excellent air flow around device
  • Includes a retractable locating guide for easy board mounting even with hundreds of leads
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Specifications
Attribute Name
Value
Brand
Textool™
Color Family
Black
Frame Style
BGA Open-top
Number of Positions
144, 169, 176, 192, 196, 324, 337, 484
Product Color
Black
Tech Sheet Number
TS-9000
Details
  • Double-beam normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress
  • Contact tips touch ball above its center plane moving ball deformation away from seating plane
  • Designed to allow excellent air flow around device
  • Includes a retractable locating guide for easy board mounting even with hundreds of leads
  • Compatible with most robotic handlers
  • Helps provide easy manual operation
  • Available in types I, II, III, and IV
  • Can reduce lead time and cost with modular tooling and optimal footprint density
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information refer to Data Sheet TS9000 (TS-9000)

3M™ Textool™ Test & Burn-In Ball Grid Array Sockets, 90XX Series double-beam, normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress. Contact tips touch ball above its center plane moving ball deformation away from seating plane. This socket is designed to allow excellent air flow around device, and helps provide easy manual operation.