- Double-beam normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress
- Contact tips touch ball above its center plane moving ball deformation away from seating plane
- Designed to allow excellent air flow around device
- Includes a retractable locating guide for easy board mounting even with hundreds of leads
Specifications
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Attribute Name
|
Value
|
|---|---|
|
Brand
|
Textool™
|
|
Frame Style
|
BGA Open-top
|
|
Number of Positions
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1152, 1156, 124, 144, 1760, 256, 324, 400, 416, 484, 672, 676, 900
|
|
Tech Sheet Number
|
TS-9300
|
Details
- Double-beam normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress
- Contact tips touch ball above its center plane moving ball deformation away from seating plane
- Designed to allow excellent air flow around device
- Includes a retractable locating guide for easy board mounting even with hundreds of leads
- Compatible with most robotic handlers
- Helps provide easy manual operation
- Accepts package body sizes up to 47.5 mm square with a maximum matrix of 45 x 45
- See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
- For more information refer to Data Sheet TS9300 (TS-9300)
3M™ Textool™ Test & Burn-In Ball Grid Array Sockets, 93XX series are available in types I, II, III. The double-beam normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress. Includes a retractable locating guide for easy board mounting even with hundreds of leads. Compatible with most robotic handlers while it provides easy manual operation.
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