3M™ Textool™ Test & Burn-In Ball Grid Array Sockets, 90XX Series

Highly reliable contact that allows for normal variation in BGA ball-diameter and position.

Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm range in package thickness tolerance

In BGA applications, direction of contact force is at 45 deg angles away from ball-seat. Results: No ball-deformation at seating plane.

Highly reliable contact that allows for normal variation in BGA ball-diameter and position
Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm range in package thickness tolerance
In BGA applications, direction of contact force is at 45 deg angles away from ball-seat. Results: No ball-deformation at seating plane
Eliminates the problem of "hinge-pinch" while applying zero closing force
For more information, refer to Data Sheet TS-9100 (TS-9100)

1.00 mm pitch Sockets, Type I, II, III

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