3M™ Through-Board Socket, 963 Series

High temperature dielectric

“No lead” reflow solder compatible

Dual row design, 4–60 pins

High temperature dielectric
“No lead” reflow solder compatible
Dual row design, 4–60 pins
Mates with pin headers for board stacking applications
Dual entry design allows mating from top side or bottom side through the printed circuit board
See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
For more information, refer to Data Sheet TS2191 (TS-2191)

963 Series, .100" (2.54mm) Board Mount Socket, Thru Hole, SMT

Data Sheets

(PDF , 112KB)

Discontinuation Notices

(PDF , 2MB)

Data Sheets

(PDF , 642KB)

3D Models

(ZIP , 39KB)

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