3M Embedded Capacitance Material for Data Center
3M Embedded Capacitance Material for Data Center
About 3M Embedded Capacitance Material (ECM)
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Designing devices for today’s rapidly changing market requires responding to long-term trends such as rising speeds, decreasing voltages and miniaturization. But making electronics smaller, lighter and faster creates increased challenges with power and signal integrity, electromagnetic compatibility and printed circuit board (PCB) complexity.
Offering high capacitance density, 3M Embedded Capacitance Material (ECM) helps respond to these challenges and get your designs built faster. These laminate materials can be embedded into PCB and chip packages for high-speed digital and signal filter designs. They help increase usable board area while decreasing the resonance that causes EMI and reducing power bus noise and PCB impedance.
They also designed to dissipate heat better than thin FR-4 due to higher thermal conductivity and low thermal impedance. Together these features help solve performance issues earlier in the design cycle for improved board reliability and lower costs.
Contact Us with 3M Embedded Capacitance Material Questions
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Key Resources
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Copyright © 2003 IEEE. Reprinted from IEEE Transactions on Electromagnetic Compatibility, Vol. 45, No. 1, February 2003. *
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Presented at the 2007 IPC Printed Circuits Expo, Apex and Designers Summit on Wed., Feb 21, 2007 at the Los Angeles Convention Center, Los Angeles, California.
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*This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of 3M's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
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