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  • 3M™ Wafer De-Taping Tape 3305
  • 3M™ Wafer De-Taping Tape 3305

    Part Number 33053M ID EMMDM2WaferDetapingTape3305
    • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
    • Transparency allows for inspection without tape removal
    • High instant adhesion to substrate
    • Good holding power
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    Details
    • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
    • Transparency allows for inspection without tape removal
    • High instant adhesion to substrate
    • Good holding power

    3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

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