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3M™ Universal Cover Tape (UCT) 2688A

  • Transparent polypropylene film tape with layer of static dissipative coating on the component side and a synthetic, room temperature pressure sensitive adhesive strip along each edge
  • Features an innovative peeling design with repeatable tracks and score lines to remove only the center part of the cover tape
  • Designed to offer smooth peeling performance with a tight range, helping reduce vibration and component movement, while increasing overall pick-and-place productivity
  • Highly recommended for WLCSP, bare dies and ultra-thin packages that require a high performing cover tape
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Specifications
Attribute Name
Value
Adhesive Type
Pressure Sensitive
Elongation
150 %
Haze Percentage
3 %
Overall Length (Metric)
300 m
Overall Thickness (Metric)
0.048 mm
Overall Width (Metric)
5.4 mm, 9.3 mm
Product Color
Transparent
Product Type
Pressure Sensitive Cover Tape
Recommended Application
Bare Die, Discrete, IC, LED, Passive, WLCSP
Tape Type
Static Dissipative
Details
  • Transparent polypropylene film tape with layer of static dissipative coating on the component side and a synthetic, room temperature pressure sensitive adhesive strip along each edge
  • Features an innovative peeling design with repeatable tracks and score lines to remove only the center part of the cover tape
  • Designed to offer smooth peeling performance with a tight range, helping reduce vibration and component movement, while increasing overall pick-and-place productivity
  • Highly recommended for WLCSP, bare dies and ultra-thin packages that require a high performing cover tape
  • Works well on 3M™ Polycarbonate Carrier Tapes
  • 300 m rolls are available in standard widths of 5.4 mm, 9.3 mm, 13.3 mm and 21.3 mm

3M™ Universal Cover Tape (UCT) 2688A is specially designed with a transparent polypropylene film and synthetic room temperature pressure sensitive adhesive (PSA) strips. It also has static dissipative film on the component side.

3M cover tape 2688A provides a very smooth peeling process and is appropriate for wafer level chip scale packages (WLCSP), bare dies and ultra thin packages.

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Note: Other widths are available per customer's requirement. Please contact us for more information
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