- Precisely engineered three-dimensional microreplicated asperities and pores, helps to ensure uniform asperity diameter and height and pore depth.
- An innovative groove design helps provide efficient and uniform slurry flow distribution.
- The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of advanced node CMP processes.
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Overall Diameter (Imperial)
Overall_Diameter_Imperial
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Overall Diameter (Imperial)
Specifications
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Attribute Name
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Value
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|---|---|
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Brand
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Trizact™
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Manufacturing Location
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United States
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Overall Diameter (Imperial)
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20 in, 29.1 in, 29.5 in, 30.5 in
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Overall Diameter (Metric)
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508 mm, 739.14 mm, 749.3 mm, 774.7 mm, 508 mm, 739.14 mm, 749.3 mm, 774.7 mm
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Product Details
- Precisely engineered three-dimensional microreplicated asperities and pores, helps to ensure uniform asperity diameter and height and pore depth.
- An innovative groove design helps provide efficient and uniform slurry flow distribution.
- The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of advanced node CMP processes.
3M™ Trizact™ CMP Pad uses microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life.
An innovative pad for Chemical Mechanical Polishing (CMP) for advanced node semiconductor manufacturing.
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