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3M™ Through-Board Socket, 966 Series

  • High temperature dielectric
  • “No lead” wave and reflow solder compatible
  • Dual row design, 4–72 pins
  • Mates with pin headers for board stacking applications
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Specifications
Attribute Name
Value
Color
Black
Contact Material
Copper Alloy
Flammability
UL 94V-0
Insulation Material
High Temperature Thermoplastic
Insulation Resistance
> 5 x 10^8 Ohm at 100 VDC
Tech Sheet Number
TS-2193
Temperature Range
-25 Degrees C to +105 Degrees C, -25C to +105C
Details
  • High temperature dielectric
  • “No lead” wave and reflow solder compatible
  • Dual row design, 4–72 pins
  • Mates with pin headers for board stacking applications
  • Dual entry design allows mating from top side or bottom side through the printed circuit board
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information, refer to Data Sheet TS2193 (TS-2193)

966 Series, .100" (2.54mm) Board Mount Socket, Thru Board, Straight, Solder Tail

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