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3M™ Three-Wall Condo Header, 3000 Series

  • Stacked pins conserve space on the circuit board allowing higher density packaging
  • Pin quantity to 128 gives design flexibility with latching
  • HDI alternative
  • Three-wall fits in VME board stacking criteria
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Specifications
Attribute Name
Value
Brand
3M™
TDS Required
Yes
Tech Sheet Number
TS-0773
Details
  • Stacked pins conserve space on the circuit board allowing higher density packaging
  • Pin quantity to 128 gives design flexibility with latching
  • HDI alternative
  • Three-wall fits in VME board stacking criteria
  • Accepts standard IDC sockets
  • Mates with standard flat cable harnesses
  • High temperature insulator suitable for "no lead" soldering operations
  • Suitable for reflow soldering using "paste in hole" techniques
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information, refer to Data Sheet TS0773 (TS-0773)

.100” x .100” Latch/Ejector, Right Angle

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