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3M™ Thermally Conductive Silicone Interface Pad 5516S

  • Good thermal conductivity (3.1 w/m-k)
  • Good softness and is conformable at low pressure ( Shore 00 =72)
  • Softness results in low stress on board components
  • Good dielectric properties
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3M™ Thermally Conductive Silicone Interface Pads Selection Guide

Details
  • Good thermal conductivity (3.1 w/m-k)
  • Good softness and is conformable at low pressure ( Shore 00 =72)
  • Softness results in low stress on board components
  • Good dielectric properties
  • “S” version incorporates a thin polymeric film carrier for improved handling and a non-tacky surface for ease of rework
  • Slight tack allows pre-assembly. Good wettability for better thermal conductivity
  • UL 94 V-1
  • High temperature résistance
  • Tacky both sides
  • Thickness : 0.5 mm,1.0 mm, 1.5 mm, 2.0 mm, custom thickness
  • Larger sheet size is available

3M™ Thermally Conductive Silicone Interface Pad 5516S is a very conformable and soft pad with very high thermal conductivity of 3.1 W/m-K (ASTM D5470). This pad is the "S" version of 5516, featuring a supporting layer for easy handling and assembly. This pad consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.

3M™ Thermally Conductive Silicone Interface Pad 5516S has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.


Recommended Applications:
Heat transfer between PCB and heat sink
Integrated chip (IC) packaging heat conduction
Chip on film (COF) heat dissipation
Gap filling in electronic devices
Decrease of compression stress to electronic parts by thermal pad softness


Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices


Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.

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