- Good thermal conductivity (3.0 W/m-K)
- Hardness : Shore 00 = 80
- Good dielectric properties
- UL 94 V-0
- High temperature resistance
- Good converting for complicated shape
- Good flexibility with over bending
- Thin thickness for lower thermal impedance.
- Roll is available
3M™ Thermally Conductive Silicone Interface Pad 5515 is designed to provide a preferential heat transfer path between heat generating components and cooling device for thin thickness (0.2-0.25 mm) requirement.