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3M™ Thermally Conductive Acrylic Interface Pad 5567H

  • High thermal conductivity (3.0 W/m-K)
  • Good conformability for gap filler
  • Non silicone
  • Slightly tacky surface
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  • High thermal conductivity (3.0 W/m-K)
  • Good conformability for gap filler
  • Non silicone
  • Slightly tacky surface
  • Thickness : 0.5 mm, 1.0 mm, 1.5 mm
  • Different width and length roll is available
  • Low odor

3M™ Thermally Conductive Acrylic Interface Pad 5567H is a very conformable and soft pad with high thermal conductivity of 3.0 W/m-K (3M test method). This pad consists of a slightly tacky acrylic elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.

3M™ Thermally Conductive Acrylic Interface Pad 5567H has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.


Our family of 3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to protect against electrical interference and device breakdown.


Recommended Applications:
Heat transfer between PCB and heat sink
Decrease of compression stress to electronic parts by thermal pad softness
Gap filling in electronic devices
Chip on film (COF) heat dissipation
Power electronic component thermal management


Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.