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3M™ Thermal Bonding Film AF111

Part Number AF111
  • Moderate tack
  • Thick 10 mil caliper
  • 250 degree F (121 degree C) cure
  • High metal OLS and peel adhesion
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  • Moderate tack
  • Thick 10 mil caliper
  • 250 degree F (121 degree C) cure
  • High metal OLS and peel adhesion
  • High flow
  • 40 degree F (4 degree C) storage required

3M™ Thermal Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).

Additional Information
This hot melt film adhesive may be cured at temperatures as low as 225 Degrees F. Provides excellent strength for either metal to melt or honeycomb sandwich applications. Releases no volatile by-products during cure thereby permitting low pressure bonding.

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