1. All 3M Products

3M™ Thermal Bonding Film AF111

3M ID B10454895
  • Moderate tack
  • Thick 10 mil caliper
  • 250 degree F (121 degree C) cure
  • High metal OLS and peel adhesion
 More...
View Legal Disclaimer
Details
  • Moderate tack
  • Thick 10 mil caliper
  • 250 degree F (121 degree C) cure
  • High metal OLS and peel adhesion
  • High flow
  • 40 degree F (4 degree C) storage required

3M™ Thermal Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).

This hot melt film adhesive may be cured at temperatures as low as 225 Degrees F. Provides excellent strength for either metal to melt or honeycomb sandwich applications. Releases no volatile by-products during cure thereby permitting low pressure bonding.

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.
Follow Us
The brands listed above are trademarks of 3M.
Change Location
United States - English