- Flexible
- Heat or solvent activation
- Can be die-cut
- Slight surface tack
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Overall Length (Imperial)
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Overall Length (Metric)
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Overall Width (Imperial)
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Overall Width (Metric)
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17 Products Available
Available options:
Overall Length (Imperial), Overall Length (Metric), Overall Width (Imperial) and Overall Width (Metric)
Specifications
|
Attribute Name
|
Value
|
|---|---|
|
Brand
|
3M™
|
|
Color Family
|
Brown
|
|
Curing Temperature (Celsius)
|
107 Degree Celsius, 107 Degree Fahrenheit
|
|
Curing Temperature (Fahrenheit)
|
225 Degree Fahrenheit
|
|
Maximum Operating Temperature (Celsius)
|
150 Degree Celsius
|
|
Maximum Operating Temperature (Fahrenheit)
|
300 Degree Fahrenheit
|
|
Overall Length (Imperial)
|
180 yd, 3 yd, 360 yd, 60 yd
|
|
Overall Length (Metric)
|
164.592 m, 2.743 m, 329.184 m, 54.864 m
|
|
Overall Thickness (Metric)
|
5 mm
|
|
Overall Width (Imperial)
|
0.5 in, 0.75 in, 1 in, 10 in, 12 in, 18 in, 2 in, 24 in, 3 in, 4 in, 48 in, 6 in, 9 in
|
|
Overall Width (Metric)
|
101.6 mm, 12.7 mm, 1219.2 mm, 152.4 mm, 19.05 mm, 228.6 mm, 25.4 mm, 254 mm, 304.8 mm, 457.2 mm, 50.8 mm, 609.6 mm, 76.2 mm
|
|
Product Color
|
Brown
|
|
Shear Strength
|
14 psi
|
Details
- Flexible
- Heat or solvent activation
- Can be die-cut
- Slight surface tack
- Heat crosslinkable option
- Lower temperature lamination of the nitrile phenolic film range
3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.
Resources
Data Sheets