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3M™ Textool™ Test & Burn-In Ball Grid Array Sockets, 90XX Series

  • Highly reliable contact that allows for normal variation in BGA ball-diameter and position.
  • Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm range in package thickness tolerance
  • In BGA applications, direction of contact force is at 45 deg angles away from ball-seat. Results: No ball-deformation at seating plane.
  • Eliminates the problem of "hinge-pinch" while applying zero closing force.
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Specifications
Attribute Name
Value
Brand
3M™
Tech Sheet Number
TS-9100
Details
  • Highly reliable contact that allows for normal variation in BGA ball-diameter and position.
  • Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm range in package thickness tolerance
  • In BGA applications, direction of contact force is at 45 deg angles away from ball-seat. Results: No ball-deformation at seating plane.
  • Eliminates the problem of "hinge-pinch" while applying zero closing force.
  • For more information, refer to Data Sheet TS-9100 (TS-9100)

1.00 mm pitch Sockets, Type I, II, III

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