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  • 3M™ Pak 50 Stacking Compression Connector, 388 Series
  • 3M™ Pak 50 Stacking Compression Connector, 388 Series

    • No solder joints, compression stacking connector
    • Standardized interface for Intel Modular Interface eXtension (MIX) Bus (module to module and module to baseboard connector)
    • Connector heights tailored for Multibus II environment
    • 130 contacts to fully accommodate "MIX" bus signals
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    Specifications
    Attribute Name
    Value
    Contact Material
    BeCu
    Insulation Material
    Glass Filled Polyester (PBT)
    Insulation Resistance
    >1 X 10^9 Ohms @ 500 Vdc
    Interface Style
    Printed Circuit Board (PCB)
    Tech Sheet Number
    TS-0422
    Details
    • No solder joints, compression stacking connector
    • Standardized interface for Intel Modular Interface eXtension (MIX) Bus (module to module and module to baseboard connector)
    • Connector heights tailored for Multibus II environment
    • 130 contacts to fully accommodate "MIX" bus signals
    • RoHS* compliant
    • For more information, refer to Data Sheet TS0422 (TS-0422)

    Stacking, 130 Position with jack screws

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