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3M™ MetPak™ 2-FB Inverse Header, MP2 Series

  • 16 mm to 18.5 mm high-profile stacking
  • Pin counts up to 300
  • Footprint compatible with standard Futurebus+®
  • Ideal for hot swapping applications
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Specifications
Attribute Name
Value
Color
Beige
Contact Material
Copper Alloy
Flammability
UL 94V-0
Insulation Material
High Temp LCP
Material
High Temp LCP
Tech Sheet Number
TS-1123
Temperature Rating
-55 Degree C to +125 Degree C
Wiping Area (Plating)
See Ordering Information
Withstanding Voltage
1000 VAC
Details
  • 16 mm to 18.5 mm high-profile stacking
  • Pin counts up to 300
  • Footprint compatible with standard Futurebus+®
  • Ideal for hot swapping applications
  • End-to-end stackable
  • Mates with MP2-R Series for parallel stacking applications
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information, refer to Data Sheet TS1123 (TS-1123)

2 mm 5-Row, Stacking, Solder or Press-Fit Tail

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