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3M™ MetPak™ 2-FB Inverse Header, MP2 Series

  • Three levels of early mate, late break (EMLB) sequencing or selective loading options
  • Footprint compatible with standard Futurebus+®
  • Solder tail with true-position wafer
  • Ideal for hot swapping applications
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Specifications
Attribute Name
Value
Color
Beige
Contact Material
Copper Alloy
Flammability
UL 94V-0
Insulation Material
High Temp LCP, High Temperature LCP
Insulation Resistance
10^3 MegaOhms
Tech Sheet Number
TS-1122
Temperature Rating
-55 Degree C to +125 Degree C
Wiping Area (Plating)
See Ordering Information
Withstanding Voltage
1000 VAC
Details
  • Three levels of early mate, late break (EMLB) sequencing or selective loading options
  • Footprint compatible with standard Futurebus+®
  • Solder tail with true-position wafer
  • Ideal for hot swapping applications
  • End-to-end stackable
  • Right angle male for daughter card
  • Mates with MP2-R for backplane applications and MP2-SXXXG for coplanar applications
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information, refer to Data Sheet TS1122 (TS-1122)

2 mm 5-Row, Right Angle, Solder Tail

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