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3M™ Fluorinert™ Electronic Liquid FC-40, 0.75 gal Plastic Container, 5 kg (11 lb) Can

Part Number FC-403M ID 98021248814UPC 00051138992576
  • Thermal stability
  • Chemical stability
  • Wide liquid range
  • Non-conductive
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Typical Properties
Attribute Name
Value
Application
Electronic Testing, Heat Transfer
Application Category
Electronic Testing, Heat Transfer
Boiling Point (Celsius)
165 Degree Celsius
Boiling Point Range
150 °C - 200 °C
Brand
Fluorinert™
Compatibility
Metals, Plastics
Density
1.85 g/cm³
Dielectric Strength Range
>40 ( 0.1" gap, kV)
Fluorocarbon Solubility
Very High
GWP (IPCC 2007)
>5000 (100 yr ITH)
GWP Range
High
Hydrocarbon Solubility
Low
Max Use Temp Range
<300 Degree C
Net Weight (Imperial)
11.02 lb
Net Weight (Metric)
5 kg
Overall Height (Imperial)
9.49 in
Overall Height (Metric)
24.1 cm
Overall Length (Imperial)
7.52 in
Overall Length (Metric)
19.1 cm
Overall Width (Imperial)
7.64 in
Plastic Elastomer Compatibility
Excellent
Product Series
FC-40
Purity Grade
Standard
Volume (Imperial)
1 gal
Volume (Metric)
3.79 L
Details
  • Thermal stability
  • Chemical stability
  • Wide liquid range
  • Non-conductive
  • Narrow boiling range
  • Compatibility

3M™ Fluorinert™ Liquid FC-40 is a non-conductive, thermally and chemically stable fluid ideal for single phase heat transfer fluid applications, especially in the electronics and semiconductor industry for testers, CVD and TFT manufacturing.

Clear, colorless, non-conductive, non-flammable, residue free, thermally and chemically stable liquid ideal for use in many heat transfer fluid applications. Its wide liquid range (-57 to 165 deg C) and compatibility makes it well suited for a variety of electronic single and two phase heat transfer applications, including in the semiconductor market for etchers, ion implanters, testers, CVD and TFT manufacturing. Because FC-40 has a narrow boiling range, its composition will change little with time, this keeps fluid loss to a minimum and insures consistent transport properties.

Suggested Applications

  • Ideal for use in many single phase heat transfer applications in the semiconductor manufacturing industry.

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