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3M™ Electrically Conductive Thermosetting Film 2201P

  • Thermoset Epoxy / Acrylic Hybrid
  • Metallized (Ni/Cu/Ni) Polymeric (PET) Scrim
  • Good grounding performace
  • Excellent Adhesion to many substrates
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Details
  • Thermoset Epoxy / Acrylic Hybrid
  • Metallized (Ni/Cu/Ni) Polymeric (PET) Scrim
  • Good grounding performace
  • Excellent Adhesion to many substrates
  • Modest thermal bonding process conditions

3M™ Electrically Conductive Thermosetting Film (C-TSF) 2201P is an XYZ-axis electrically conductive thermosetting film. This double-sided film has a nickel/copper-coated conductive nonwoven carrier. Designed for EMI shielding and grounding applications, enabling devices to meet electromagnetic compatibility requirements.

3M™ Electrically Conductive Thermosetting Film 2201P typically has the highest electrical conductivity, adhesion, and overall performance of conductive pressure sensitive adhesive (CPSA) products due to the thermoset resin. The excellent conductivity makes it ideal for small contact areas. This tape requires a modest thermal bonding process under pressure and special storage conditions. This tape provides robust protection against EMI in a range of market segments such as consumer electronics, automotive, medical devices, communication infrastructure, and aerospace & defense electronics.


Recommended Applications:
PCB/flex/chassis grounding
Bond line gap shielding
Electrostatic discharge (ESD)
EMI shield & gasket attachment
Passive intermodulation (PIM) management


From simple to complex designs, our family of shielding and grounding solutions provides protection against EMI. Our solutions provide excellent adhesion to a variety of substrates including metals and plastics. These tapes are easy to apply using low pressure without heat, enhancing productivity. We have multiple thicknesses available to meet even the most space constrained and complex design requirements.