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3M™ Diamond Pad Conditioner Ring E187, 260-mm dia

Part Number E1873M ID 60020012419UPC 00051111700044
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
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Specifications
Attribute Name
Value
Abrasive Working Surface
Segmented
Aggressiveness
70-90
Application
CMP
Brand
3M™
Carrier Color
Gray
Carrier Format
Ring
Carrier Material
304 Stainless Steel
Carrier Size
10.24 inch diameter
Carrier Substrate
304 SS
CMP Process
Cu (bulk), PMD/ILD, W (bulk)
Diamond Size
181 um
Diamond Type
Type 4, semi-sharp
Manufacturing Location
United States
Mineral Type
Nickel based alloy with patterned diamond
Product Series
E187
Product Type
Diamond Pad Conditioner Ring
TDS Required
Yes
Product Details
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

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