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3M™ Diamond Pad Conditioner H80-AL, 95 mm diameter

Part Number H80-AL3M ID 60020014852UPC 00051111722497
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
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Specifications
Attribute Name
Value
Abrasive Material
Nickel based alloy with patterned diamond
Abrasive Working Surface
Full Face
Application
CMP
Carrier Color
Gray
Carrier Format
Disk - double sided
Carrier Size
3.74 inch diameter
Carrier Substrate
304 SS
CMP Process
Hard Disk Drive Media Polishing
Diamond Size
74 um
Diamond Type
Type 2, blocky
Manufacturing Location
United States
Product Series
H80-AL
Product Type
Diamond Pad Conditioner
TDS Required
No
Product Details
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

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Product Disclaimer
  • Use of pad conditioners in process is pad dependent. Additional processes may be supported, contact 3M lab to verify product recommendations
  • The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes
  • 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.

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