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3M™ Diamond Pad Conditioner A2812, 4.25 in diameter

Part Number A28123M ID 60020020313UPC 00051111900451
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for superior retention
  • Exclusive polymer substrate enhances corrosion resistance
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Specifications
Attribute Name
Value
Abrasive Material
Nickel based alloy with patterned diamond
Abrasive Working Surface
Ring Face
Aggressiveness
25-29
Application
CMP
Carrier Color
Black
Carrier Format
Disk - with bevel edge
Carrier Size
4.25 inch diameter
Carrier Substrate
Polycarbonate
Diamond Size
181 um
Diamond Type
Type 4, semi-sharp
Manufacturing Location
United States
Product Type
Diamond Pad Conditioner
Product Details
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for superior retention
  • Exclusive polymer substrate enhances corrosion resistance

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and protrusion.

Legal Disclaimer

Product Disclaimer
  • Use of pad conditioners in process is pad dependent. Additional processes may be supported, contact 3M lab to verify product recommendations
  • The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes
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