Attribute Name
|
Value
|
---|---|
Abrasive Working Surface
|
Ring Face
|
Aggressiveness
|
1-10
|
Application
|
CMP
|
Carrier Color
|
Gray
|
Carrier Format
|
Disk - with bevel edge
|
Carrier Size
|
4.25 inch diameter
|
Carrier Substrate
|
304 SS
|
CMP Process
|
STI Process
|
Diamond Size
|
63 um
|
Diamond Type
|
Type 9, sharp
|
Manufacturing Location
|
United States
|
Mineral Type
|
Nickel based alloy with patterned diamond
|
Product Series
|
A272
|
Product Type
|
Diamond Pad Conditioner
|
TDS Required
|
No
|
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and protrusion.