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3M™ Diamond Pad Conditioner A188H, 4.25-in dia

Part Number A188H3M ID 60020020578UPC 00051111900703
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
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Specifications
Attribute Name
Value
Abrasive Working Surface
Full Face
Aggressiveness
20-26
Application
CMP
Carrier Color
Black
Carrier Format
Disk - with bevel edge
Carrier Size
4.25 inch diameter
Carrier Substrate
Polycarbonate
CMP Process
Cu (bulk), PMD/ILD, STI Process, W (bulk)
Diamond Size
251 um
Diamond Type
Type 4, semi-sharp
Manufacturing Location
United States
Mineral Type
Nickel based alloy with patterned diamond
Product Series
A188H
Product Type
Diamond Pad Conditioner
TDS Required
Yes
Product Details
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

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Product Disclaimer
  • Use of pad conditioners in process is pad dependent. Additional processes may be supported, contact 3M lab to verify product recommendations
  • The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes
  • 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.

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