3M™ ACF 7303 is an epoxy/acrylate-blend adhesive system filled with 43 micron silver-coated glass beads. It is slightly tacky at room temperature and cures at modest bonding temperature and pressure.
The unbonded film is slightly tacky at room temperature and consists of a thermosetting epoxy/acrylate adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuit lines through the adhesive thickness, but are spaced far enough apart for the product to be electrically insulating in the plane of the adhesive. Hard conductive particles are preferred for copper traces, as they embed into traces for good electrical performance. 3M™ ACF 7303 may be used to bond a flexible printed circuit to another flexible printed circuit or to a printed circuit board.